In recent times, the demand for top powered electronics has grown exponentially. With fast development in electrical/hybrid autos, we’re seeing that extra electronics and energy modules are wanted to maintain up with demand. Nevertheless, EV/Hybrid autos usually are not the one functions driving this elevated demand. Different main functions, akin to rail traction, wind generators, photovoltaic inverters and motor drives are additionally driving the elevated demand. These functions are extraordinarily demanding and are working at excessive voltage and excessive present densities that should address excessive temperatures and harsh situations. One of many key parts for a extremely dependable energy module is an especially dependable metallic ceramic substrate. Substrate supplies for these functions will need to have excellent traits by way of electrical, thermal, insulation, and mechanical efficiency throughout operation. To have a dependable system in place it is advisable have a suitable interconnection and meeting supplies like solder paste, sinter paste, and wire bonding, to call a couple of.
Resulting from value effectivity, Al2O3 primarily based metallic ceramic substrates, like direct copper bonded substrates are sometimes used for energy module manufacturing. Though, it’s a cheaper resolution, it’s not at all times the most effective for sure functions, particularly for top energy modules. Al2O3 primarily based ceramic substrates wrestle to harness the total energy of extensive band hole semiconductors. On this occasion, a superior substrate is required. Silicon nitride (Si3N4) primarily based metallic ceramic substrates have been used in recent times for energy module meeting. Its superior mechanical properties, akin to bending energy, fracture toughness and thermal conductivity makes Si3N4 a beautiful resolution for a extremely dependable, excessive energy density module base. As we speak Si3N4 substrates are manufactured utilizing lively metallic brazing (AMB) know-how, which makes use of Ag-filled and titanium containing brazing pastes. Treasured metallic and sophisticated processing steps drive the costs up for AMB substrates making it a costlier possibility.
Heraeus Electronics has developed an answer that solves the price and efficiency roadblocks beforehand described. It’s a value environment friendly, extremely dependable Ag-free AMB copper bonding know-how for becoming a member of nitride-based ceramics with copper foils. The fabric was developed utilizing a method the place there isn’t any requirement for utilizing costly vacuum-based brazing and longer course of time. The product is called: Condura®.extremely, a Si3N4 Ag free AMB substrate.
- Excellent reliability and processing (eg. Sintering, bonding, soldering…)
- Price environment friendly Si3N4 metallic ceramic substrate
- Permits thick Cu layers
- Thinner ceramics vs. AIN doable for equal thermal
- Thermal conductivity of Si3N4 ceramic:
Condura®.extremely is a cost-efficient Ag free AMB bonding know-how for metallic ceramic substrates which can be appropriate for top finish functions. The fee discount of Condura®.extremely is achieved through the use of a silver-free brazing know-how mixed with an environment friendly brazing course of.
Under in Determine 1, it provides a have a look at the thermal shock efficiency of Condura®.extremely.
SAM photos of 20 particular person Condura®.extremely check layouts earlier than and after thermal shock checks (liquid to liquid -65 ° C to + 150 ° C). No main degradation is seen after 8000 cycles. The crimson coloration signifies the etched isolation groove which is a part of the check format. Within the occasion of delamination between copper and brazed metallic as a consequence of thermal shock, the crimson coloration groove would broaden. This exhibits that Condura®.extremely qualifies to completely leverage the mechanical robustness of the Si3N4 ceramics in the same method because the Ag containing AMB know-how.
Heraeus Electronics reveals at PCIM Europe 10-12th Could
Condura®.extremely will launch globally this yr at PCIM Europe. PCIM Europe is the main convention and exhibition for energy electronics, renewable vitality, and vitality administration, happening in Nuremberg from Could 10-12, 2022. Whereas on the present go to Heraeus Electronics in Corridor 6, Sales space 322 to talk with our group about Condura®.extremely or a few of our different new options for interconnects and die connect.
Be a part of Heraeus Electronics Stay on the e-mobility discussion board
On Tuesday Could 10th at 11:20am CEST Heraeus Electronics will supply a sneak peak at our mAgic® Copper Sinter Paste with a presentation titled “ How close to is copper sintering”. For extra info, please go to us on the present or attain out to your native account supervisor.
On Wednesday Could 11th at 12:50pm CEST Heraeus Electronics current on the Condura® product household and the way Heraeus Electronics will meet rising buyer expectations on the reliability, thermal efficiency, lifetime and value of metallic ceramic substrates. Additionally on this presentation a brand new addition to the Condura® product line shall be unveiled.